Chun Howe Sim

Title: Innovations of Chun Howe Sim

Introduction

Chun Howe Sim is an accomplished inventor based in Bayan Lepas, Malaysia. He is known for his significant contributions to the field of integrated circuit packaging. His innovative approach has led to the development of a unique patent that enhances thermal management in electronic devices.

Latest Patents

Chun Howe Sim holds a patent for a "Bathtub integrated heat spreader with multiple thermal-interface material for integrated-circuit packages." This invention includes embodiments that feature multiple thermal-interface materials at the interface between an integrated heat spreader and a heat sink. The primary thermal-interface material possesses flow qualities, while the secondary thermal-interface material offers containment and adhesive qualities. The integrated heat spreader is designed in a basin form factor that accommodates the primary thermal-interface material. This innovation is crucial for improving the efficiency and reliability of electronic devices.

Career Highlights

Chun Howe Sim is currently employed at Intel Corporation, a leading technology company known for its advancements in semiconductor manufacturing. His work at Intel has allowed him to collaborate with some of the brightest minds in the industry, further enhancing his expertise and contributions to technology.

Collaborations

Chun Howe Sim has worked alongside Chew Ching Lim, a talented female engineer. Their collaboration has fostered a creative environment that encourages innovative solutions in their projects.

Conclusion

Chun Howe Sim's contributions to the field of integrated circuit packaging through his innovative patent demonstrate his commitment to advancing technology. His work at Intel Corporation and collaboration with talented colleagues highlight the importance of teamwork in driving innovation.