Location History:
- Tainan County, TW (2012)
- Tainan, TW (2015 - 2017)
Company Filing History:
Years Active: 2012-2017
Title: Innovations of Chun-Hao Su
Introduction
Chun-Hao Su is a prominent inventor based in Tainan, Taiwan. He has made significant contributions to the field of microelectromechanical systems (MEMS) with a total of six patents to his name. His work focuses on innovative manufacturing methods and device designs that enhance the functionality and efficiency of MEMS technology.
Latest Patents
One of his latest patents is a manufacturing method for a microelectromechanical system (MEMS) package structure. This method involves providing a base with a recess, disposing a chip in the recess, and placing a MEMS device on the active surface of the chip. The MEMS device is covered by a first cover that includes a cavity, and a sealant is used to seal the cavity. Additionally, a glass frit is utilized to secure a second cover over the base, ensuring the integrity of the package structure through heating.
Another notable patent is for a microelectromechanical system (MEMS) device that features a hinge layer. This device includes a substrate with at least one MEMS unit that comprises first and second electrodes, a landing element, and a hinge layer. The hinge layer is designed to allow movement when a voltage difference is applied, enabling the cantilever portion to interact with the landing element.
Career Highlights
Chun-Hao Su is currently employed at Himax Display, Inc., where he continues to innovate in the MEMS field. His work has contributed to advancements in MEMS technology, making it more applicable in various industries.
Collaborations
He has collaborated with notable coworkers such as Wei-Hsiao Chen and Tung-Feng Wu, further enhancing the innovative capabilities of his projects.
Conclusion
Chun-Hao Su's contributions to the field of microelectromechanical systems through his patents and work at Himax Display, Inc. highlight his role as a key innovator in this technology sector. His inventions are paving the way for future advancements in MEMS applications.