Himax Display, Inc.

Chun-Hao Su

Wei-Hsiao Chen

Tung-Feng Wu

Roland V Gelder

Jui-Wen Chen

Mao-Chien Cheng

Bing-Jei Liao

Nan Liu

Chien-Tang Wang

Tore Nauta

Yin-Hsie Chang

Hui-Lun Chen

A manufacturing method of a microelectromechanical system (MEMS) package structure includes providing a base, wherein the base comprises a recess; disposing a chip in the recess, wherein the chip has an active surface; disposing a MEMS device on the active surface in the recess, wherein the MEMS device is covered by a first cover, the first cover comprises a cavity, and the MEMS device is in the cavity; disposing a sealant at a peripheral gap between the chip and the first cover so as to seal the cavity; disposing a glass frit on a second cover or the base; disposing the second cover on the base, wherein the second cover covers the recess, and the glass frit is disposed between the base and the second cover; and heating the glass frit so as to seal the recess.

Manufacturing method thereof

A microelectromechanical system (MEMS) device includes a substrate and at least one MEMS unit disposed on the substrate. The MEMS unit includes at least one first electrode, at least one second electrode, at least one landing element, and a hinge layer. The first electrode is disposed on the substrate. The second electrode is disposed on the substrate. The landing element is disposed on the substrate. The hinge layer includes a hinge portion and at least one cantilever portion. The hinge portion is connected to the second electrode. The cantilever portion is connected to the hinge portion. The cantilever portion has a first opening and at least one spring disposed in the first opening and connected to at least one side of the first opening. When a voltage difference exists between the first electrode and the second electrode, the hinge portion is distorted and the spring thus touches the landing element.

Microelectromechanical system device having a hinge layer

A MEMS package structure includes a base, a MEMS device, a first cover, a second cover and a glass frit. The base includes a recess. The MEMS device is disposed in the recess. The first cover is disposed in the recess and covering the MEMS device. The second cover is disposed on the base and covering the recess. The glass frit is disposed between the base and the second cover. A MEMS package structure includes the base, the MEMS device, the first cover, a second cover, a first metal frame and a first sealing medium. The first metal frame is disposed around the second cover, and the second cover and the first metal frame collectively are disposed on the base and covering the recess. The first sealing medium is disposed between the first metal frame and the base. Manufacturing methods of the MEMS package structures above are further provided.

MEMS package structure and manufacturing method thereof

A MEMS package structure is disclosed. The MEMS package structure includes a first glass substrate on a micro-electromechanical systems (MEMS) structure, a sealant adhered between the first glass substrate and the MEMS structure; and a first moisture barrier on the sidewalls of the first glass substrate, the sealant, and the MEMS structure.

MEMS package structure and method for fabricating the same

A MEMS package structure including a chip, a MEMS device, a lid, a sealant and a first moisture barrier is provided. The chip comprises an active surface. The MEMS system device is disposed on the active surface. The lid is covered on the chip and comprising a recess, wherein the MEMS device is in the recess. The sealant is disposed between the chip and the lid so as to seal the recess, wherein a thickness of the sealant is less than a height of the MEMS device. The first moisture barrier is sealed around the chip, the sealant and the lid.

MEMS package structure

A liquid crystal on silicon (LCOS) display panel and an electronic device using the same are provided. The electronic device comprises the LCOS display panel and a circuit board. The LCOS display panel comprises a silicon substrate, a transparent substrate and a liquid crystal layer. The transparent substrate has a base plate and a mask layer. The circuit board is electrically connected to the display panel. The transparent substrate is disposed opposite to the silicon substrate, and the liquid crystal layer is positioned between the silicon substrate and the transparent substrate. The base plate has a first surface and a second surface opposite to the first surface that faces the silicon substrate. The mask layer is disposed on the second surface and has at least one opening to form at least one light-transmitting region and one light-blocking region, and the light-transmitting region is a displaying region of the transparent substrate.

Growing community of inventors

Tainan, Taiwan

Chun-Hao Su