The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2015
Filed:
Jan. 29, 2014
Applicant:
Himax Display, Inc., Tainan, TW;
Inventors:
Chun-Hao Su, Tainan, TW;
Roland V. Gelder, Tainan, TW;
Tore Nauta, Tainan, TW;
Wei-Hsiao Chen, Tainan, TW;
Assignee:
Himax Display, Inc., Tainan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); B81B 7/00 (2006.01); G02B 5/08 (2006.01); G02B 27/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0058 (2013.01); G02B 5/08 (2013.01); G02B 27/0006 (2013.01);
Abstract
A MEMS package structure including a chip, a MEMS device, a lid, a sealant and a first moisture barrier is provided. The chip comprises an active surface. The MEMS system device is disposed on the active surface. The lid is covered on the chip and comprising a recess, wherein the MEMS device is in the recess. The sealant is disposed between the chip and the lid so as to seal the recess, wherein a thickness of the sealant is less than a height of the MEMS device. The first moisture barrier is sealed around the chip, the sealant and the lid.