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For the Inventor, By the Inventor

Hsinchu, Taiwan

Chun-Fan Tsai

This inventor holds 20 USPTO granted patents and 23 published patent applications, primarily in Mobile Communications. Top assignees: Mediatek Corporation, Mediatek Singapore Pte. Ltd.. Active years: 2018-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chun-Fan Tsai. Retrieved from https://idiyas.com/inventor/chun-fan-tsai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 20 

% Patents Active = 100.0

Average Co-Inventor Count = 2.1

ph-index = 2

Forward Citations = 15(Granted Patents)


Location History:

  • Houlong Township, Miaoli County, TW (2018)
  • Hsinchu, CN (2021)
  • Hsinchu, TW (2021 - 2024)

Company Filing History:

goldMedal16 out of 5,102 
 
Mediatek Corporation
 patents
silverMedal4 out of 988 
 
Mediatek Singapore Pte. Ltd.
 patents

Years Active: 2018-2026

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Areas of Expertise:
Mobile Communications
Handover Methods
Multi-Radio Access
Resource Sharing
Sidelink Relay
Secure Transmission
Cell Group Activation
UE Coordination
Access Delay Reduction
Measurement Gaps
Mobility Enhancement
CSFB Call Setup
20 patents (USPTO):Explore Patents
1. 12750742 - Group handover with delayed or omitted signaling for layer 2 sidelink relaying (2026-09-29),
2. 12701474 - Methods and apparatus to activate secondary cell group (SCG) selectively (2026-08-04),
3. 12666336 - Method and apparatus for ensuring secure transmission in mobile communications (2026-06-23),
4. 12660027 - Method and apparatus to have efficient resource sharing for UE with multiple SIM cards (2026-06-16),
5. 12550218 - Apparatuses and methods for enabling secondary cell group (SCG) suspension and resumption or primary secondary cell (PSCell) deactivation and activation (2026-02-10),
6. 12396056 - Methods and apparatus of sidelink relay based data communication (2025-08-19),
7. 12335800 - User equipment (UE)-triggered handover with early preparation in mobile networks (2025-06-17),
8. 12219650 - Apparatuses and methods for multi-radio access technology (RAT) coordination (2025-02-04),
9. 11991572 - User equipment (UE)-triggered handover with early preparation in mobile networks (2024-05-21),
10. 11751279 - Apparatuses and methods for multi-radio access technology (RAT) coordination (2023-09-05),
11. 11729637 - Enhancement to expedite secondary cell (SCell) or primary SCell (PSCell) addition or activation (2023-08-15),
12. 11546820 - Enhanced handover methods and apparatuses using the same (2023-01-03),
13. 11470523 - Apparatuses and methods for user equipment (UE) to report new radio (NR) measurement gap requirement information (2022-10-11),
14. 11452016 - Dual-protocol for mobility enhancement (2022-09-20),
15. 11224082 - Methods and apparatus to improve MR-DC SN addition procedure (2022-01-11),

Title: The Innovative Journey of Inventor Chun-Fan Tsai

Introduction: Chun-Fan Tsai, a distinguished inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology through his groundbreaking innovations.

Latest Patents: Chun-Fan Tsai's latest patents include advancements in semiconductor technology, particularly in the development of cutting-edge microchips with enhanced processing capabilities.

Career Highlights: With a career spanning over two decades, Tsai has worked with leading tech companies in Taiwan, spearheading research and development projects that have led to the creation of revolutionary products in the electronics industry.

Collaborations: Throughout his career, Chun-Fan Tsai has collaborated with top researchers, engineers, and scientists both locally and internationally, fostering a culture of innovation and excellence in all his projects.

Conclusion: Chun-Fan Tsai's relentless pursuit of innovation and his passion for pushing the boundaries of technology have solidified his reputation as a visionary inventor in the global tech community.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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