This inventor holds 1 USPTO granted patent. Top assignee: Auras Technology Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Chun-Chi Lai and Fluid Heat Dissipation Innovation.
Introduction
Chun-Chi Lai is an inventor based in New Taipei, Taiwan. His work includes a patented fluid heat dissipation device designed to support cooling applications.
Latest Patents
Lai’s patent, “Fluid Heat Dissipation Device,” describes a first cold plate for cooling a heat source, an adapter connected to the cold plate, and a fluid delivery pipeline connected to the adapter and in fluid communication with the cold plate. The design aims to improve the production efficiency and quality of the device. Lai is credited with 1 patent.
Career Highlights
Lai is associated with Auras Technology Ltd. His patent focuses on the design and production of fluid-based heat dissipation equipment.
Collaborations
Chia-Hung Li and Chien-Yu Chen are identified as Lai’s coworkers.
Conclusion
Chun-Chi Lai’s patented device addresses fluid-based cooling and manufacturing considerations, reflecting his work in heat dissipation technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile