The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2026

Filed:

Apr. 26, 2024
Applicant:

Auras Technology Co., Ltd., New Taipei City, TW;

Inventors:

Chia-Hung Li, New Taipei City, TW;

Chun-Chi Lai, New Taipei City, TW;

Chien-Yu Chen, New Taipei City, TW;

Assignee:

AURAS TECHNOLOGY CO., LTD., New Taipei City, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20272 (2013.01); H05K 7/20254 (2013.01); H05K 7/20218 (2013.01);
Abstract

A fluid heat dissipation device includes a first cold plate, a first adapter and a fluid delivery pipeline. The first cold plate is used to cool a first heat source, the first adapter is connected to the first cold plate, and the fluid delivery pipeline is connected to the first adapter and fluidly communicated with the first cold plate to improve the production efficiency and quality of the fluid heat dissipation device.


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Li, Chia-Hung. (2026). Fluid heat dissipation device (U.S. Patent No. 12764902). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12764902

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