Taichung, Taiwan

Chun-Chang Ting


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2022-2023

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2 patents (USPTO):Explore Patents

Title: Innovations by Chun-Chang Ting

Introduction

Chun-Chang Ting is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging, holding a total of 2 patents. His work focuses on improving the reliability and performance of electronic components.

Latest Patents

Chun-Chang Ting's latest patents include a method for fabricating an electronic package with multiple electronic components spaced apart by grooves. This innovative approach involves forming a filling material in an interval, where a plurality of electronic components are disposed on a carrying structure. The filling material acts as a spacer with a groove, which serves as a stress buffering region. This design helps prevent the electronic components from breaking due to stress concentration.

Career Highlights

Chun-Chang Ting is currently employed at Siliconware Precision Industries Co., Ltd. His work at this company has allowed him to develop and refine his innovative ideas in electronic packaging. His contributions have been instrumental in advancing the technology used in the industry.

Collaborations

Chun-Chang Ting has collaborated with notable coworkers, including Hong-Da Chang and Chi-Jen Chen. Their teamwork has fostered an environment of innovation and creativity, leading to the development of cutting-edge technologies.

Conclusion

Chun-Chang Ting's work in electronic packaging exemplifies the importance of innovation in technology. His patents reflect a commitment to enhancing the reliability of electronic components, making significant strides in the industry.

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