Hsinchu, Taiwan

Chuan-Chi Yan

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chuan-Chi Yan. Retrieved from https://idiyas.com/inventor/chuan-chi-yan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Chuan-Chi Yan and a Biological Material Sensing Semiconductor Device.

Introduction

Chuan-Chi Yan is an inventor associated with Hsinchu, Taiwan, and Taiwan Semiconductor Manufacturing Company Limited. His patent work includes a semiconductor device designed to sense biological material.

Latest Patents

Yan is credited with 1 patent: “Biological Material Sensing Semiconductor Device.” The invention describes a method for fabricating a biological sensing device that combines a field-effect transistor (FET) with a fluid-accessible cavity. A via extends through the cavity floor and is electrically coupled to the transistor’s gate, while a sensing layer covers part of the floor and the raised portion of the via. The sensing layer reacts when exposed to biological material, enabling the device to detect it.

Career Highlights

Yan’s listed patent reflects work at the intersection of semiconductor fabrication and biological sensing. The design integrates a sensing surface and transistor structure in a configuration intended to interact with fluid samples.

Collaborations

The patent’s listed coworkers include Yueh-Chuan Lee and Chia-Chan Chen. Yan is associated with Taiwan Semiconductor Manufacturing Company Limited.

Conclusion

Chuan-Chi Yan’s patent describes a semiconductor-based approach to biological material sensing, combining a fluid-accessible structure, an electrically connected via, and a reactive sensing layer.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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