Hsinchu, Taiwan

Chu-Chuan Huang

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chu-Chuan Huang. Retrieved from https://idiyas.com/inventor/chu-chuan-huang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Chu-Chuan Huang: Innovator in Waveguide Technology

Introduction

Chu-Chuan Huang is an inventor based in Hsinchu, Taiwan. He is known for his contributions to waveguide technology, focusing on methods for forming waveguides and edge fill processes in stacked structures. Although he currently holds no granted patents, his innovative ideas are reflected in his latest patent applications.

Latest Patent Applications

Huang's recent patent applications include "WAVEGUIDES AND METHODS OF FORMING THE SAME." This application describes a method that involves depositing a waveguide cladding layer over a substrate, reshaping the cladding layer to create a bevel profile, and forming a recess for a waveguide core layer. The process culminates in planarizing both the waveguide core and cladding layers to establish a functional waveguide core. Another application, "EDGE FILL FOR STACKED STRUCTURE," outlines a process for depositing an edge fill dielectric over a workpiece and device, followed by patterning and planarization to achieve a dielectric-to-dielectric bond with a second workpiece.

Conclusion

Chu-Chuan Huang's work in waveguide technology showcases his innovative spirit and potential for future contributions to the field. His latest patent applications reflect a commitment to advancing technology, even as he seeks to secure granted patents.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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