This inventor holds 6 USPTO granted patents. Top assignees: Siemens Medical Systems, Inc., Siemens Medical Solutions USA, Inc.. Active years: 1997-2026.
Location History:
- Redmond, WA (US) (1997 - 2000)
- Sammamish, WA (US) (2011)
Company Filing History:


Years Active: 1997-2026
Title: Innovations by Christopher S. Chapman
Introduction
Christopher S. Chapman is an accomplished inventor based in Redmond, WA (US). He holds a total of 6 patents that showcase his contributions to the field of ultrasound technology. His work has significantly advanced the capabilities of medical imaging and diagnostics.
Latest Patents
One of his notable patents is for a "Three-dimensional fly-through systems and methods using ultrasound data." This innovation allows for the representation of a volume using high spatial resolution ultrasound data. By modulating B-mode data with Doppler or flow information, the spatial resolution or contrast of the B-mode data may be enhanced. The same set of ultrasound data is utilized for identifying a boundary, placing the perspective position within the volume, and rendering from that perspective. The identification of the boundary and rendering can be automated or performed by a processor. This technology enables the generation of three-dimensional fly-through representations, facilitating virtual endoscopy and other diagnostically useful views of structures or fluid flow channels. The virtual processes are non-invasive, enhancing patient comfort and offering selectable depths of focus. They may also allow for fly-through of various types of anatomy and serve as a training tool.
Another significant patent is for a "Multifrequency ultrasonic transducer for 1.5D imaging." This invention features an ultrasonic transducer with a center row of transducers operating at a center frequency, along with first and second outer rows of transducers that may operate at a common frequency or different frequencies lower than the center frequency. The enhancement of the ultrasonic transducer array includes a matching layer with an acoustic velocity that is higher than those associated with the outer row transducers. This design allows for high-resolution near-field imaging while improving far-field imaging without the need for a 2D transducer array.
Career Highlights
Christopher has worked with prominent companies in the medical field, including Siemens Medical Systems, Inc. and Siemens Medical Solutions USA, Inc. His experience in these organizations has contributed to his expertise in ultrasound technology and medical imaging.
Collaborations
Throughout his career, Christopher has collaborated with notable professionals such as John C. Lazenby and Qinglin Ma. These collaborations have likely enriched his work and led to further advancements in his field.
Conclusion
Christopher S. Chapman is a distinguished inventor whose innovations in ultrasound technology have made a significant impact on medical imaging. His