Riekofen, Germany

Christoph Kamseder

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Infineon Technologies Ag. Active years: 2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Christoph Kamseder. Retrieved from https://idiyas.com/inventor/christoph-kamseder

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

 

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: Christoph Kamseder: Innovator in Electronic Die Manufacturing

Introduction

Christoph Kamseder is a notable inventor based in Riekofen, Germany. He has made significant contributions to the field of electronic die manufacturing. His innovative approach has led to the development of a unique method that enhances the efficiency of separating electronic dies from wafers.

Latest Patents

Kamseder holds a patent for the "Separation of workpiece with three material removal stages." This method involves a systematic process of separating a wafer into electronic dies. The process includes forming a groove in the wafer with a first material removal tool, enlarging the groove with a second tool, and finally increasing the depth of the groove with a third tool until the wafer is completely separated. He has 1 patent to his name.

Career Highlights

Christoph Kamseder is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His work at Infineon has allowed him to apply his innovative ideas in a practical setting, contributing to advancements in electronic manufacturing.

Collaborations

Kamseder has collaborated with several talented individuals in his field, including Franco Mariani and Andreas Bauer. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Christoph Kamseder is a prominent figure in the realm of electronic die manufacturing, with a focus on innovative methods that improve production efficiency. His contributions and collaborations continue to shape the future of the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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