Infineon Technologies Ag

Christoph Kamseder

Thomas Fischer

Franco Mariani

Andreas Bauer

A method of manufacturing electronic dies by separating a wafer into electronic dies, wherein the method comprises forming a groove in the wafer with a first material removal tool having a first thickness, enlarging the groove by a second material removal tool having a second thickness larger than the first thickness, and subsequently increasing a depth of the groove by a third material removal tool having a third thickness smaller than the second thickness until the wafer is separated.

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Riekofen, Germany

Christoph Kamseder