This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Ev Group E. Thallner Gmbh. Active years: 2015.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2015
Title: Christian Grünseis: Innovator in Substrate Alignment Technology
Introduction
Christian Grünseis is a notable inventor based in Mehrnbach, Austria. He has made significant contributions to the field of substrate alignment technology. His innovative approach has led to the development of a unique device aimed at reducing wedge errors during the alignment process.
Latest Patents
Grünseis holds a patent for a "Device and method for reducing a wedge error." This device is designed to align a first surface of a first substrate with a second surface of a second substrate as they move toward each other across a gap. The invention addresses critical challenges in substrate alignment, enhancing precision and efficiency in various applications.
Career Highlights
Christian Grünseis is currently employed at EV Group E. Thallner GmbH, a company known for its advanced technology solutions in the semiconductor and microelectronics industries. His work at this organization has allowed him to further develop his expertise and contribute to groundbreaking innovations.
Collaborations
Grünseis collaborates with talented individuals such as Michael Kast and Alois Malzer. Their combined efforts foster a creative environment that drives innovation and enhances the development of new technologies.
Conclusion
Christian Grünseis exemplifies the spirit of innovation in the field of substrate alignment technology. His contributions, particularly through his patented device, demonstrate his commitment to advancing the industry. His work continues to inspire future developments in this critical area.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
