Singapore, Singapore

Choong Meng How

USPTO Granted Patents = 1 

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: Choong Meng How - Innovator in Flexible Printed Circuits

Introduction

Choong Meng How is a notable inventor based in Singapore, recognized for his contributions to the field of flexible printed circuits. His innovative approach has led to the development of a unique patent that enhances the functionality of electronic devices.

Latest Patents

Choong Meng How holds a patent for a flexible printed circuit and a method of fabricating it. This invention includes various embodiments that provide a flexible printed circuit comprising a substrate layer portion and an electrically-conductive layer portion. The electrically-conductive layer portion is superimposed over the substrate layer portion, which features an opening. Part of the electrically-conductive layer portion is positioned over this opening to create a partially detachable tab. This tab is designed for initiating the separation of one portion of the flexible printed circuit from another. The patent also outlines a corresponding method for fabricating a flexible printed circuit and a plurality of electronic devices.

Career Highlights

Choong Meng How is associated with 3M Innovative Properties Company, where he applies his expertise in developing advanced technologies. His work has significantly contributed to the innovation landscape in the electronics sector.

Collaborations

He collaborates with Siang Sin Foo, working together to push the boundaries of technology and innovation in their field.

Conclusion

Choong Meng How's contributions to flexible printed circuits exemplify the spirit of innovation. His patent not only showcases his inventive capabilities but also highlights the importance of collaboration in advancing technology.

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