The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2019

Filed:

Jun. 29, 2012
Applicants:

Siang Sin Foo, Sin Ming Walk, SG;

Choong Meng How, Choa Chu Kang Cresent, SG;

Inventors:

Siang Sin Foo, Sin Ming Walk, SG;

Choong Meng How, Choa Chu Kang Cresent, SG;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/10 (2006.01); A61B 5/0416 (2006.01); A61B 5/0408 (2006.01); H05K 3/38 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/118 (2013.01); H05K 3/10 (2013.01); A61B 5/0408 (2013.01); A61B 5/0416 (2013.01); A61B 5/04087 (2013.01); H05K 3/386 (2013.01); H05K 3/4092 (2013.01); H05K 2201/09127 (2013.01); Y10T 29/49155 (2015.01);
Abstract

Various embodiments provide a flexible printed circuit comprising a substrate layer portion and an electrically-conductive layer portion. The electrically-conductive layer portion may be superimposed over the substrate layer portion. The substrate layer portion may have an opening formed therein and part of the electrically-conductive layer portion may be positioned over the opening to form a partially detachable tab. The tab may be for use in initiating separation of one portion of the flexible printed circuit from another portion of the flexible printed circuit. Various embodiments provide a corresponding method of fabrication of a flexible printed circuit. Various embodiments provide a corresponding method of fabrication of a plurality of electronic devices.


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