3M Innovative Properties Company

Choong Meng How

Siang Sin Foo

Various embodiments provide a flexible printed circuit comprising a substrate layer portion and an electrically-conductive layer portion. The electrically-conductive layer portion may be superimposed over the substrate layer portion. The substrate layer portion may have an opening formed therein and part of the electrically-conductive layer portion may be positioned over the opening to form a partially detachable tab. The tab may be for use in initiating separation of one portion of the flexible printed circuit from another portion of the flexible printed circuit. Various embodiments provide a corresponding method of fabrication of a flexible printed circuit. Various embodiments provide a corresponding method of fabrication of a plurality of electronic devices.

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Singapore, Singapore

Choong Meng How