This inventor holds 2 USPTO granted patents. Top assignee: Micron Technology Incorporated. Active years: 2002-2003.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2002-2003
Title: Choong L Wah: Semiconductor Packaging Inventor
Introduction
Choong L Wah is an inventor based in Singapore whose patent work concerns semiconductor packaging. He is associated with Micron Technology Incorporated and is credited with 2 patents.
Latest Patents
His listed latest patent, “U-shape tape for BOC FBGA package to improve moldability,” describes an FBGA packaged device in which a die is attached to a substrate with a narrow gap between them. An opening through the substrate lies near the center of the die, and encapsulating material surrounds the die, extends into the gap, and fills the channel. A barrier positioned between the substrate and die helps control the flow of encapsulating material during molding.
Career Highlights
Choong’s patent record reflects work on improving moldability in semiconductor packages. The described design focuses on managing encapsulant flow around the die and through the package structure.
Collaborations
Choong is associated with Micron Technology Incorporated. His listed coworkers include Lee Choon Kuan and Tim Teoh.
Conclusion
Choong L Wah’s patent work addresses semiconductor packaging, with a focus on controlling mold flow to support the manufacture of FBGA devices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile