Company Filing History:
Years Active: 1999-2001
Title: Choon Kun Ryu: Innovator in Dielectric Layer Technology
Introduction
Choon Kun Ryu is a notable inventor based in Sunnyvale, CA (US). He has made significant contributions to the field of semiconductor technology, particularly in the area of dielectric layer deposition. With a total of 3 patents to his name, Ryu's work has had a substantial impact on improving manufacturing processes in the industry.
Latest Patents
Ryu's latest patents include innovative methods and apparatuses for enhancing gap-fill capability using chemical and physical etchbacks. One of his patents describes a method for depositing a dielectric layer to fill gaps between adjacent metal lines. In this method, a first dielectric layer is deposited over the lines and subsequently etched using both chemical and physical etchback steps. After completing the etchback steps, a second dielectric layer is deposited over the first layer to effectively fill in the gap. This approach not only improves the efficiency of the process but also enhances the reliability of the semiconductor devices produced.
Career Highlights
Choon Kun Ryu is currently employed at Applied Materials, Inc., a leading company in the semiconductor equipment industry. His work at Applied Materials has allowed him to collaborate with other talented professionals and contribute to groundbreaking advancements in technology.
Collaborations
Some of Ryu's notable coworkers include Soonil Hong and Michael P Nault. Their collaborative efforts have further propelled innovations in the field, showcasing the importance of teamwork in achieving technological advancements.
Conclusion
Choon Kun Ryu's contributions to dielectric layer technology exemplify the innovative spirit of the semiconductor industry. His patents reflect a commitment to improving manufacturing processes and enhancing device reliability. Ryu's work continues to influence the field, making him a significant figure in the world of inventions.