Company Filing History:
Years Active: 2025
Title: Innovations of Chonghee Lee in Semiconductor Packaging
Introduction
Chonghee Lee is a notable inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative designs and solutions. His work is particularly recognized for enhancing the efficiency and functionality of semiconductor devices.
Latest Patents
Chonghee Lee holds a patent for a semiconductor package that includes a package substrate featuring a redistribution layer. This layer consists of first pads and second pads on its upper surface, along with a solder mask layer that has an opening exposing the first pads entirely and partially exposing the second pads. The semiconductor chip is positioned on the upper surface of the package substrate, featuring connection pads that are electrically connected to the redistribution layer. Connection bumps are located below the semiconductor chip, linking the connection pads to the first pads. Additionally, a non-conductive film layer is situated between the semiconductor chip and the package substrate. The design ensures that the second pads are positioned on both sides of the first pads in a specified direction, with the connection bumps spaced apart from the second pads and the solder mask layer.
Career Highlights
Chonghee Lee is currently associated with Samsung Electronics Co., Ltd., a leading global technology company. His role at Samsung has allowed him to work on cutting-edge technologies and contribute to advancements in semiconductor packaging. His innovative approach has positioned him as a key player in the industry.
Collaborations
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Conclusion
Chonghee Lee's contributions to semiconductor packaging reflect his innovative spirit and technical expertise. His patent for a sophisticated semiconductor package demonstrates his commitment to advancing technology in this critical field. His work continues to influence the development of efficient semiconductor solutions.
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