Samsung Electronics Co., Ltd.

University-Industry Cooperation Group of Kyung Hee University

Chonghee Lee

Yunrae Cho

Byunghoon Ko

Eunkyul Oh

Keunho Jang

Sub Sunoo

Hun Young Park

Sang Seok Nam

Sangkon Bae

A semiconductor package includes a package substrate including a redistribution layer including first pads and second pads on an upper surface thereof and a solder mask layer having an opening exposing the first pads entirely and exposing at least portion of each of the second pads, a semiconductor chip on the upper surface of the package substrate and including connection pads electrically connected to the redistribution layer, connection bumps below the semiconductor chip and connecting the connection pads to the first pads, and a non-conductive film layer between the semiconductor chip and the package substrate, wherein the second pads are respectively disposed on both sides of the first pads at least in a first direction, and the connection bumps are spaced apart from the second pads and the solder mask layer in the first direction.

Semiconductor package

Growing community of inventors

Suwon-si, South Korea

Chonghee Lee