Choi Keng Chan

Title: Innovations of Choi Keng Chan in Printed Circuit Board Technology

Introduction

Choi Keng Chan is a notable inventor based in Penang, Malaysia. He has made significant contributions to the field of printed circuit board technology. With a total of 3 patents to his name, Chan's work focuses on enhancing the reliability and performance of electronic devices.

Latest Patents

One of Choi Keng Chan's latest patents involves printed circuit boards that feature pads designed for solder balls. This innovation includes a group of pads that are suitable for soldering to a respective group of solder balls of a device. Each pad is strategically designed with a crack initiation point on its perimeter, which is crucial for anticipating where cracks in a solder ball may begin after soldering. For pads that contain a microvia, the center of the microvia is positioned farther from the crack initiation point than the center of the pad itself. Additionally, for pads with traces merging along their perimeter, this portion is designed to avoid the vicinity of the crack initiation point, thereby enhancing the durability of the connection.

Career Highlights

Choi Keng Chan is currently employed at Intel Corporation, where he continues to innovate in the field of electronics. His work at Intel has allowed him to collaborate with leading experts in the industry, further advancing the technology behind printed circuit boards.

Collaborations

Some of his notable coworkers include Cheng Siew Tay and Wendy Chet Ming Ngoh, who contribute to the collaborative environment at Intel Corporation. Their combined expertise fosters innovation and drives the development of cutting-edge technologies.

Conclusion

Choi Keng Chan's contributions to printed circuit board technology exemplify the importance of innovation in the electronics industry. His patents not only enhance the functionality of devices but also pave the way for future advancements in the field.