This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Innovations of Chiu-Chun Wang in Heat Exchange Technology
Introduction
Chiu-Chun Wang is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of thermal management, particularly in the design of heat exchange apparatuses. His innovative work focuses on enhancing the efficiency of cooling systems in computing devices.
Latest Patents
Chiu-Chun Wang holds a patent for a "Heat exchange apparatus and methods for hyperbaric cooling fan applications." This invention involves a heat exchange apparatus designed to improve cooling efficiency in computing devices. The apparatus is made from a material with high thermal conductivity and is strategically overlaid on the internal surface of the housing. This design allows the internal surface to be exposed to hot air flowing inside the housing, while the external surface occludes some existing through-holes. As a result, the apparatus transforms these through-holes into passive heat exchanging regions, effectively transferring heat from inside to outside the housing. This innovation helps lower the internal air temperature and the junction temperature of heat-generating components without requiring any reworking of the original industrial design.
Career Highlights
Chiu-Chun Wang is currently employed at Intel Corporation, where he continues to develop cutting-edge technologies in thermal management. His work is crucial in enhancing the performance and reliability of computing devices.
Collaborations
Chiu-Chun Wang has collaborated with several talented individuals, including Chi Chou Cheng and Srinivasarao Konakalla. These collaborations have contributed to the advancement of innovative solutions in the field.
Conclusion
Chiu-Chun Wang's contributions to heat exchange technology exemplify the importance of innovation in improving the efficiency of cooling systems in computing devices. His patent reflects a significant advancement in thermal management, showcasing his expertise and commitment to enhancing technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile