This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2025
Title: The Innovative Contributions of Chipta Priya Laksana
Introduction
Chipta Priya Laksana is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative patent. His work is recognized for its potential to enhance the efficiency and effectiveness of electronic components.
Latest Patents
Laksana holds a patent for a dicing process in packages comprising organic interposers. This method involves forming an interconnect component that includes multiple dielectric layers made of organic dielectric material. The process also incorporates a series of redistribution lines that extend into these dielectric layers. Furthermore, it includes bonding two package components to the interconnect component, encapsulating them, and precutting the interconnect component to create a trench. This trench penetrates through the interconnect component and partially extends into the encapsulant. The method concludes with a singulation process that separates the package components into distinct packages. Laksana's patent is a testament to his innovative approach in the semiconductor industry, with a total of 1 patent to his name.
Career Highlights
Chipta Priya Laksana is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His role at the company allows him to work on cutting-edge technologies and contribute to advancements in semiconductor manufacturing processes.
Collaborations
Laksana collaborates with talented individuals in his field, including Chun-Lung Jao and Shu-Shen Yeh. These collaborations enhance the innovative potential of his projects and contribute to the overall success of their endeavors.
Conclusion
Chipta Priya Laksana's contributions to the field of semiconductor packaging through his innovative patent demonstrate his expertise and commitment to advancing technology. His work continues to influence the industry and pave the way for future innovations.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile