This inventor holds 1 USPTO granted patent. Top assignee: Asm Assembly Automation Limited. Active years: 2012.
Company Filing History:
Years Active: 2012
Title: Innovations of Ching Yuen To in Electronic Device Bonding
Introduction
Ching Yuen To is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of electronic device bonding, particularly with his innovative rotary clip bonder. His work has led to advancements in the efficiency and effectiveness of bonding multiple connector clips onto electronic devices.
Latest Patents
Ching Yuen To holds a patent for a rotary clip bonder, which allows multiple connector clips to be bonded onto an electronic device simultaneously. This invention features a pick head with a plurality of collets positioned at a clip supply channel. The design enables a fixed orientation for the connector clips, which are picked up and conveyed to a bonding area. The pick head rotates using a rotary motor, changing the orientation of the clips before they are bonded to the electronic device.
Career Highlights
Ching Yuen To is currently employed at Asm Assembly Automation Limited, where he continues to innovate in the field of assembly automation. His work has been instrumental in enhancing the capabilities of electronic device manufacturing.
Collaborations
Ching Yuen To collaborates with talented individuals such as Wai Lik Chan and Man Chung Ng, contributing to a dynamic work environment that fosters innovation and creativity.
Conclusion
Ching Yuen To's contributions to the field of electronic device bonding through his rotary clip bonder patent exemplify his innovative spirit and dedication to advancing technology. His work continues to impact the industry positively.