Ching-Wen Liu

Title: Ching-Wen Liu: Innovator in Intelligent Power Module Packaging

Introduction

Ching-Wen Liu is a notable inventor based in Taoyuan, Taiwan, recognized for his significant contributions to the field of power device packaging. With four patents to his name, Liu's inventions demonstrate a commitment to advancing technology in intelligent power management.

Latest Patents

One of Liu's latest patents is focused on an intelligent power module packaging structure. This innovative design includes an insulated heat dissipation substrate paired with multiple power devices and a control chip. The control chip provides essential functions such as gate driving for the power devices and pulse width modulation. This intelligent structure not only enhances the performance of power devices but also manages heat efficiently, facilitating better reliability.

Another of his recent inventions involves a power device package structure that incorporates a first and second substrate along with at least one power device. The first substrate boasts a heat conductivity greater than 200 W/mK, ensuring efficient thermal management. The second substrate, which has a higher heat capacity, is placed beneath the first substrate to further enhance the thermal properties of the package. This notable design encapsulates both substrates along with the power device, marking a significant advancement in packaging technology.

Career Highlights

Ching-Wen Liu is affiliated with Actron Technology Corporation, where he plays a vital role in developing cutting-edge technologies. His work has centered primarily on improving power device performance and efficiency. Liu's continuous innovation in packaging technologies reflects his dedication to solving complex engineering challenges in the electronics industry.

Collaborations

Throughout his career, Liu has collaborated with Hsin-Chang Tsai, a fellow innovator in the field. Their partnership demonstrates the importance of teamwork in driving forward technological advancements. Together, they have combined their expertise to push the boundaries of what is possible in power device packaging.

Conclusion

Ching-Wen Liu's contributions to the field of intelligent power module packaging are noteworthy and illustrate a profound understanding of the complexities involved in modern electronics. With his innovative spirit and collaborative efforts with colleagues like Hsin-Chang Tsai, Liu continues to pave the way for future advancements in power management solutions. His patents not only improve current technologies but also set a solid foundation for the innovations of tomorrow.