The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 25, 2022
Filed:
Sep. 07, 2018
Applicant:
Actron Technology Corporation, Taoyuan, TW;
Inventors:
Hsin-Chang Tsai, Taoyuan, TW;
Ching-Wen Liu, Taoyuan, TW;
Assignee:
ACTRON TECHNOLOGY CORPORATION, Taoyuan, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01); H01L 23/532 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/28 (2013.01); H01L 23/373 (2013.01); H01L 23/53233 (2013.01); H01L 23/53242 (2013.01); H01L 23/53257 (2013.01);
Abstract
A power device package structure including a first substrate, a second substrate, at least one power device, and a package is provided. A heat conductivity of the first substrate is greater than 200 WmK. The power device is disposed on the first substrate, and the second substrate is disposed under the first substrate. A heat capacity of the second substrate is greater than that of the first substrate. The package encapsulates the first substrate, the second substrate, and the power device.