This inventor holds 2 USPTO granted patents and 3 published patent applications. Top assignee: Powertech Technology Inc.. Active years: 2025-2026.
Company Filing History:
Years Active: 2025-2026
Title: Innovations of Ching-Wei Liao
Introduction
Ching-Wei Liao is a notable inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of packaging technology, holding a total of 2 patents. His work focuses on advanced package structures and manufacturing methods that enhance the performance and efficiency of electronic devices.
Latest Patents
Liao's latest patents include innovative package structures and their respective manufacturing methods. The first patent describes a package structure that consists of a redistribution layer, a conductive element, an active chip, an encapsulation layer, another redistribution layer, and a conductive terminal. This design ensures that the conductive element, active chip, and encapsulation layer are effectively integrated, with the encapsulation layer surrounding both the conductive element and the active chip. The second patent outlines a package structure that features a first package and a second package, where the second package is positioned atop the first. The first package includes a first redistribution layer, at least one chip, and a second redistribution layer, while the second package incorporates a third redistribution layer and multiple light-emitting elements.
Career Highlights
Ching-Wei Liao is currently employed at Powertech Technology Inc., a leading company in the semiconductor packaging industry. His work at Powertech has allowed him to develop cutting-edge technologies that contribute to the advancement of electronic packaging solutions.
Collaborations
Liao collaborates with Shang-Yu Chang Chien, a talented female engineer, to further enhance their innovative projects. Their teamwork exemplifies the importance of collaboration in driving technological advancements.
Conclusion
Ching-Wei Liao's contributions to packaging technology through his patents and work at Powertech Technology Inc. highlight his role as a key innovator in the field. His advancements are paving the way for more efficient electronic devices and packaging solutions.