Ching Ting Peng

Title: Ching Ting Peng: Innovator in Chip Packaging Technology

Introduction

Ching Ting Peng is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in chip packaging. His innovative approach has led to the development of a unique chip package that enhances the performance and reliability of semiconductor devices.

Latest Patents

Ching Ting Peng holds a patent for a "Chip package and manufacturing method thereof." This invention includes a semiconductor substrate, an interlayer dielectric (ILD) layer, a first metal shielding layer, and a redistribution layer. The semiconductor substrate features a first surface, a second surface facing away from the first surface, an inclined sidewall adjoining the first and second surfaces, and a through hole that connects the two surfaces. The ILD layer is positioned on the first surface of the semiconductor substrate, with a first conductive pad structure and a second conductive pad structure embedded within it. The first metal shielding layer is situated on the ILD layer, with a portion integrated into the ILD layer and on the second conductive pad structure. The redistribution layer is located on the second surface of the semiconductor substrate, the wall surface of the through hole, and the first conductive pad structure. This patent showcases his innovative approach to chip packaging, which is crucial for modern electronics.

Career Highlights

Ching Ting Peng is currently employed at Xintec Corporation, where he continues to push the boundaries of semiconductor technology. His work has been instrumental in advancing chip packaging methods, which are essential for the miniaturization and efficiency of electronic devices. With a focus on innovation, he has successfully developed solutions that address the challenges faced in the semiconductor industry.

Collaborations

Ching Ting Peng collaborates with talented professionals in his field, including Hsin-Yi Chen and Sheng-Hsiang Fu. These collaborations foster a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Ching Ting Peng is a prominent inventor whose work in chip packaging technology has made a significant impact on the semiconductor industry. His innovative patent demonstrates his commitment to advancing technology and improving the performance of electronic devices. Through his career at Xintec Corporation, he continues to contribute to the evolution of semiconductor technology.