This inventor holds 1 USPTO granted patent. Top assignee: Xintec Corporation. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Innovations of Ching-Ting Peng in Chip Packaging Technology.
Introduction
Ching-Ting Peng is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in chip packaging. His innovative approach has led to the development of a unique chip package that enhances the performance and reliability of semiconductor devices.
Latest Patents
Ching-Ting Peng holds a patent for a "Chip package and manufacturing method thereof." This invention includes a semiconductor substrate, a conductive pad, an isolation layer, and a redistribution layer. The semiconductor substrate features a first surface, a second surface facing away from the first surface, a through hole that connects both surfaces, and a recess in the first surface. The conductive pad is strategically placed on the second surface of the semiconductor substrate and within the through hole. The isolation layer surrounds the conductive pad on the second surface, while the redistribution layer extends from the first surface into the recess and onto the conductive pad in the through hole. This innovative design improves the efficiency and functionality of chip packages.
Career Highlights
Ching-Ting Peng is currently employed at Xintec Corporation, where he continues to push the boundaries of semiconductor technology. His work has been instrumental in advancing chip packaging methods, which are crucial for modern electronic devices. With a total of 1 patent, he has established himself as a key player in the industry.
Collaborations
Ching-Ting has collaborated with talented individuals such as Sheng-Hsiang Fu and Hsin-Yi Chen, who contribute to the innovative environment at Xintec Corporation. Their combined expertise fosters a culture of creativity and technological advancement.
Conclusion
Ching-Ting Peng's contributions to chip packaging technology exemplify the importance of innovation in the semiconductor industry. His patent reflects a significant advancement that can lead to improved electronic devices. The impact of his work will likely resonate within the field for years to come.