Ching-Shun Huang

Title: The Innovative Work of Ching-Shun Huang

Introduction

Ching-Shun Huang, an accomplished inventor based in Chigtong Township, Yunlin County, Taiwan, has made significant contributions to the field of electronics through his innovative ideas. With a focus on improving the mechanical reliability of electronic packaging, his patent reflects a deep understanding of material properties and engineering challenges in modern technology.

Latest Patents

Huang holds a notable patent titled "Structure of Dielectric Layers in Built-Up Layers of Wafer Level Package." This invention provides a unique structure of elastic dielectric layers featuring specific through holes near the angle of a Redistribution Layer (RDL) within Wafer Level Packages (WLP). By utilizing silicone-based materials with precise ranges for Coefficient of Thermal Expansion (CTE), elongation rate, and hardness, Huang's invention aims to enhance the mechanical reliability of electronic components during temperature cycling tests. Moreover, the structure addresses potential cracking issues by reducing stress accumulation at the dielectric layer interface adjacent to the RDL.

Career Highlights

Ching-Shun Huang is associated with Advanced Chip Engineering Technology, Inc., where he continues to leverage his expertise to innovate within the microelectronics sector. His work at this company showcases the intersection of academic research and practical application, contributing to the advancement of electronic packaging technologies.

Collaborations

Huang collaborates with esteemed colleagues, including Wen-Kun Yang and Chun-Hui Yu. Their combined efforts enhance collaborative problem-solving and innovation within their projects, fostering a dynamic environment for technological advancements.

Conclusion

Ching-Shun Huang stands as a testament to the innovative spirit that drives the electronics industry forward. His contributions, particularly through his patent, not only address specific technical challenges but also pave the way for further advancements in electronic packaging solutions. As technology continues to evolve, Huang's work underscores the importance of innovation and collaboration in creating reliable electronic components.