Hsinchu, Taiwan

Ching-San Wang

This inventor holds 1 USPTO granted patent. Top assignee: Nuvoton Technology Corporation. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ching-San Wang. Retrieved from https://idiyas.com/inventor/ching-san-wang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Ching-San Wang’s Semiconductor Innovation.

Introduction

Ching-San Wang is an inventor associated with Hsinchu, Taiwan, and Nuvoton Technology Corporation. Her patent work includes a semiconductor structure and a method for manufacturing it.

Latest Patents

The provided information lists one patent for Wang: “Semiconductor Structure and Manufacturing Method Thereof.” The invention describes a substrate with a III-V group compound layer containing at least two vertically connected trenches. The trenches become progressively narrower from the uppermost trench to the lowermost trench, which exposes part of the substrate. The patent presents both the semiconductor structure and its manufacturing method.

Career Highlights

Wang’s listed patent reflects work on semiconductor device structures and fabrication processes. The supplied data identifies 1 patent and associates her with Nuvoton Technology Corporation.

Collaborations

The provided information names Peng-Chan Hsiao and Kuang-Chu Chen as Wang’s coworkers. Their inclusion indicates professional connections, but the supplied data does not specify their roles in the patent.

Conclusion

Ching-San Wang’s listed invention focuses on a layered semiconductor structure with progressively narrowing trenches, highlighting her contribution to semiconductor technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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