Company Filing History:
Years Active: 2010
Title: Innovations by Ching-Jen Han in Manufacturing Techniques
Introduction
Ching-Jen Han, a distinguished inventor based in Taichung, Taiwan, has made significant contributions to the field of manufacturing techniques. With a patent to his name, his innovative approaches are poised to advance processes in electronics fabrication.
Latest Patents
Ching-Jen Han holds a patent for a "Method of manufacturing opening and via opening." This groundbreaking method details the steps to create an opening on a substrate that includes both a conductive portion and a dielectric layer. The process begins with the provision of a substrate, where a first dry etching step uses a reactive gas to form an opening on a passivation layer. Notably, the design includes an obtuse angle between the bottom of the opening and its inner sidewall, optimizing it further through an opening enlarging step. This innovative technique ensures that the target dimension of the bottom opening is greater than the initial dimension without exposing the conductive layer, showcasing Han's ingenuity.
Career Highlights
Ching-Jen Han is currently affiliated with Winbond Electronics Corporation, a prominent company in the electronics sector. His work there highlights his commitment to enhancing manufacturing processes in the semiconductor industry. His expertise is underscored by the successful patent he has developed, which is expected to influence future innovations in the field.
Collaborations
Collaboration plays a crucial role in Han's career, as he works alongside talented colleagues including Wen-Shun Lo and Yung-Han Chiu. Together, they contribute to advancing technologies in their respective areas of expertise, fostering an environment of innovation within Winbond Electronics Corporation.
Conclusion
Ching-Jen Han stands as a remarkable figure in the realm of manufacturing innovations. With his patented method of creating openings and enhancing the efficiency of electronic components, Han is shaping the future of manufacturing processes. His work at Winbond Electronics Corporation alongside esteemed colleagues is indicative of the collaborative spirit necessary for groundbreaking advancements in technology.