Ching-Hua Lee

Title: Innovations of Ching-Hua Lee in Image Sensor Technology.

Introduction

Ching-Hua Lee is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of image sensor technology. His innovative approach has led to the development of a unique method for integrating image sensors with optical components.

Latest Patents

Ching-Hua Lee holds a patent for a "Method for integrating image sensors with optical components." This invention describes a wafer-level integrating method for bonding an un-sliced wafer that includes image sensors with a wafer-sized substrate containing optical components. The process involves using a zeroth order light reflective substrate to enhance the integration of these components. The image sensors can be either CMOS or CCD types, and the optical components may include a blazed grating or a two-dimensional microlens array. The bonding process can be achieved through various methods, including reflow, cold compression, or thermal compression, ultimately leading to the packaging of the image sensors.

Career Highlights

Ching-Hua Lee is associated with Slight Opto-electronics Co., Ltd., where he continues to innovate in the field of optoelectronics. His work has been instrumental in advancing the capabilities of image sensors, making them more efficient and effective for various applications.

Collaborations

Ching-Hua Lee has collaborated with notable colleagues, including Chih-Kung Lee and Long-Sun Huang. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies in the field.

Conclusion

Ching-Hua Lee's contributions to image sensor technology exemplify the spirit of innovation. His patented methods and collaborative efforts continue to influence the industry positively.