This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Ching Hsien Liu: Innovator in Vacuum Technology
Introduction
Ching Hsien Liu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor manufacturing, particularly through his innovative designs in vacuum technology. His work has been instrumental in enhancing the efficiency and effectiveness of integrated circuit handling.
Latest Patents
Liu holds a patent for a "Vacuum tip assembly for use in pick-and-place tool." This invention provides die pick and place tools with an improved vacuum tip that can perform attachment and detachment of an integrated circuit die without deforming the dies. The vacuum tip includes a body with a top surface and a bottom surface, featuring a plurality of grooves that extend radially outward from a center point. Additionally, it incorporates a channel that runs from the bottom of the grooves through the body to the bottom surface, ensuring that the channel and the body are substantially co-axial. This design enhances the precision and reliability of integrated circuit handling.
Career Highlights
Ching Hsien Liu has dedicated his career to advancing semiconductor technologies. His work at Taiwan Semiconductor Manufacturing Company Limited has positioned him as a key player in the industry. Liu's innovative approach has led to the development of tools that significantly improve the manufacturing process of integrated circuits.
Collaborations
Liu collaborates with Sheng-Po Tseng, a talented engineer who contributes her expertise to their projects. Together, they work on developing cutting-edge solutions that address the challenges faced in semiconductor manufacturing.
Conclusion
Ching Hsien Liu's contributions to vacuum technology in semiconductor manufacturing highlight his innovative spirit and dedication to improving industry standards. His patent for the vacuum tip assembly exemplifies his commitment to enhancing the efficiency of integrated circuit handling. Liu's work continues to influence the field, paving the way for future advancements.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile