Taichung, Taiwan

Ching-Chia Chen

This inventor holds 1 USPTO granted patent. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ching-Chia Chen. Retrieved from https://idiyas.com/inventor/ching-chia-chen-hq9qsnd0

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2021

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1 patent (USPTO):Explore Patents

Title: Innovations of Ching-Chia Chen in Electronic Packaging

Introduction

Ching-Chia Chen is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging, particularly through his innovative patent. His work focuses on enhancing the efficiency and cost-effectiveness of electronic components.

Latest Patents

Ching-Chia Chen holds a patent for an "Electronic package and method for fabricating the same." This invention provides a packaging structure that accommodates multiple electronic components. It features an antenna structure that is stacked using conductive elements, allowing for electrical connections to various electronic components operating at different radio frequencies. This design enables mass production of radio frequency products without the need for multiple individual packaging modules, thereby reducing production costs and increasing speed.

Career Highlights

Ching-Chia Chen is associated with Siliconware Precision Industries Co., Ltd., where he applies his expertise in electronic packaging. His innovative approach has positioned him as a key player in the industry, contributing to advancements in technology and manufacturing processes.

Collaborations

Ching-Chia Chen has collaborated with notable colleagues, including Wen-Jung Tsai and Ying-Chou Tsai, who contribute to the innovative environment at Siliconware Precision Industries Co., Ltd. Their teamwork fosters a culture of creativity and technological advancement.

Conclusion

Ching-Chia Chen's contributions to electronic packaging through his patent demonstrate his commitment to innovation and efficiency in the industry. His work not only enhances production processes but also sets a precedent for future advancements in electronic component packaging.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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