Hsinchu, Taiwan

Ching-Cheng Wang

This inventor holds 1 USPTO granted patent. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ching-Cheng Wang. Retrieved from https://idiyas.com/inventor/ching-cheng-wang-5dt41l33

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2016

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1 patent (USPTO):Explore Patents

Title: Innovations by Ching-Cheng Wang

Introduction

Ching-Cheng Wang is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of defect management systems, showcasing his expertise through his innovative patent.

Latest Patents

Wang holds a patent for "Defect management systems and methods." This patent describes a system for managing defects on an object, which includes an automatic defect classification (ADC) module, a lithographic plane review (LPR) module, and a defect progression monitor (DPM) module. The DPM module is designed to obtain information regarding a defect from both the ADC and LPR modules, determining whether a repair or cleaning of the object is necessary. He has 1 patent to his name.

Career Highlights

Ching-Cheng Wang is currently employed at Taiwan Semiconductor Manufacturing Company Limited, where he applies his knowledge and skills in semiconductor manufacturing. His work focuses on enhancing the efficiency and effectiveness of defect management processes.

Collaborations

Wang collaborates with talented individuals such as You-Hong Huang and Yan-Wei Tien, who contribute to the innovative environment at their workplace.

Conclusion

Ching-Cheng Wang's contributions to defect management systems highlight his role as an influential inventor in the semiconductor industry. His innovative approach continues to drive advancements in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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