Ching-chao Lin

Title: Ching-chao Lin and Image Sensor Packaging Innovation.

Introduction

Ching-chao Lin is an inventor associated with Hsinchu, Taiwan, and Powertech Technology Inc. Her patent work includes an image sensor packaging design intended to reduce package thickness and size.

Latest Patents

Lin is credited with 1 patent: “Image Sensor and Packaging Thereof.” The invention describes an image sensing chip wrapped in encapsulant, with vias passing through the encapsulant and wire redistribution layers connecting the chip to external conducting terminals. The exterior redistribution layer is formed directly beneath the image sensing chip without a substrate. By routing electrical connections through the outer-side encapsulant vias, the design can reduce both encapsulant thickness and the overall size of the packaged image sensor.

Career Highlights

Lin’s listed patent reflects work on semiconductor packaging and image sensor interconnections. The design focuses on integrating electrical routing into the encapsulant structure while avoiding a separate substrate beneath the chip.

Collaborations

Lin is associated with Powertech Technology Inc., a company connected to her patent work. The available information identifies the company but does not specify additional collaborators.

Conclusion

Ching-chao Lin’s patent presents a compact image sensor packaging approach that uses encapsulant vias and redistribution layers to support electrical connections while reducing package size.