Hsinchu City, Taiwan

Chin-Yuan Wu

This inventor holds 1 USPTO granted patent. Top assignee: Grand Process Technology Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chin-Yuan Wu. Retrieved from https://idiyas.com/inventor/chin-yuan-wu-7ha9cd7f

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Chin-Yuan Wu and Wafer Processing Innovation.

Introduction. Chin-Yuan Wu is an inventor based in Hsinchu City, Taiwan. His work includes a patented wafer processing method, and he is associated with Grand Process Technology Corporation.

Latest Patents. Wu’s listed patent is “Wafer processing method.” It describes a process using a multifunctional single-wafer immersion and spin-cleaning device equipped with a spin drive, wafer turntable, and wafer receiving tray. A soaking tank and watertight contact gasket help retain liquid medicine at a suitable level to fully immerse the wafer during soaking. The method also includes wafer placement, lifting, soaking, and spin-cleaning steps. Wu is credited with 1 patent in the provided information.

Career Highlights. Wu’s patent focuses on combining immersion and spin cleaning in wafer processing. The described gasket and soaking-tank arrangement supports water-tight contact and controlled liquid coverage during treatment.

Collaborations. Wu’s listed coworkers include Li-Tso Huang and Hsiu-Kai Chang. The provided information associates him with Grand Process Technology Corporation.

Conclusion. Chin-Yuan Wu’s patented wafer processing method presents an approach to integrating controlled immersion and spin cleaning for wafer treatment.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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