The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2026

Filed:

Sep. 10, 2024
Applicant:

Grand Process Technology Corporation, Hsinchu City, TW;

Inventors:

Li-Tso Huang, Hsinchu City, TW;

Hsiu-Kai Chang, Hsinchu City, TW;

Chin-Yuan Wu, Hsinchu City, TW;

Ming-Che Hsu, Hsinchu City, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B08B 3/02 (2006.01); H10P 72/00 (2026.01); H10P 72/76 (2026.01);
U.S. Cl.
CPC ...
B08B 3/022 (2013.01); H10P 72/0414 (2026.01); H10P 72/7618 (2026.01);
Abstract

A wafer processing method is provided. The method includes a device providing step, a first lifting step, a wafer placing step, a second lifting step, a soaking step, and a third lifting steps, and a spinning cleaning step. The device providing step includes providing a multifunctional single wafer immersion and spin cleaning device, the device has a spin drive device, a wafer turntable, and a wafer receiving tray. A soaking tank is formed on the wafer receiving tray, and a watertight contact gasket is disposed on the wafer receiving tray to contact the wafer water-tightly such that in the soaking step, an appropriate water level of the liquid medicine can be accumulated to fully soak the wafer.


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Quick Actions:

Huang, Li-Tso. (2026). Wafer processing method (U.S. Patent No. 12773723). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12773723

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