Chin-wei Liang

Title: Chin-wei Liang: Innovator in Wafer Bonding Technology

Introduction

Chin-wei Liang is a notable inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in wafer bonding methods. His innovative approach has led to advancements that enhance the efficiency and effectiveness of semiconductor manufacturing processes.

Latest Patents

Chin-wei Liang holds a patent for an "Apparatus and method for wafer bonding." This invention includes a transfer module designed to transfer a semiconductor wafer and a plasma module that applies two types of plasma. The first type of plasma performs a reduction operation on the wafer's surface at a specific temperature range, converting metal oxides to metal. The second type of plasma activates the wafer's surface at room temperature, outside the predetermined range. This innovative method is crucial for improving the quality and performance of semiconductor devices.

Career Highlights

Chin-wei Liang is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work focuses on developing advanced technologies that streamline manufacturing processes and improve product quality. With a patent portfolio that includes 1 patent, Liang's contributions are recognized within the industry.

Collaborations

Chin-wei Liang collaborates with esteemed colleagues such as Yeong-jyh Lin and Yeur-Luen Tu. Their combined expertise fosters an environment of innovation and progress in semiconductor technology.

Conclusion

Chin-wei Liang's work in wafer bonding technology exemplifies the spirit of innovation in the semiconductor industry. His contributions not only advance manufacturing techniques but also pave the way for future developments in the field.