Taiwan Semiconductor Manufacturing Comp. Ltd.

Chin-wei Liang

Yeur-Luen Tu

Yeong-jyh Lin

An apparatus for wafer bonding includes a transfer module and a plasma module. The transfer module is configured to transfer a semiconductor wafer. The plasma module is configured to apply a first type of plasma to perform a reduction operation upon a surface of the semiconductor wafer at a temperature within a predetermined temperature range to convert metal oxides on the surface of the semiconductor wafer to metal, and apply a second type of plasma to perform a plasma operation upon the surface of the semiconductor wafer at a room temperature outside the predetermined temperature range to activate a surface of the semiconductor wafer.

Growing community of inventors

HSINCHU COUNTY, Taiwan

Chin-wei Liang