Hsin-Chu, Taiwan

Chin-Twan Wei


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 1993

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1 patent (USPTO):Explore Patents

Title: Innovations in Semiconductor Processing: The Work of Chin-Twan Wei

Introduction

Chin-Twan Wei is a notable inventor based in Hsin-Chu, Taiwan, who has made significant contributions to the field of semiconductor manufacturing. With a focus on enhancing the quality and reliability of aluminum-copper metallurgy in VLSI (Very-Large-Scale Integration), Wei has developed a cutting-edge patent aimed at eliminating voids during the production process.

Latest Patents

Wei holds a patent for his innovative method titled "Rapid thermal treatment to eliminate metal void formation in VLSI." This patent describes a sophisticated approach to forming a void-free surface on aluminum-copper metallurgy after the resist stripping process. By utilizing rapid thermal annealing at temperatures between 400°C to 550°C, his technique ensures a high-quality finish that is crucial for semiconductor performance. The method involves exposing, developing, and etching a resist layer, followed by plasma oxygen ashing to remove the mask. The end result is a void-free aluminum-copper metallurgy surface, which is vital for ensuring the integrity of semiconductor devices.

Career Highlights

Chin-Twan Wei has worked at Taiwan Semiconductor Manufacturing Company Ltd., a leader in the semiconductor industry. His patent reflects his commitment to advancing manufacturing techniques and improving product reliability. His work directly contributes to the efficiency of semiconductor fabrication, which is essential in today’s technology-driven world.

Collaborations

Throughout his career, Wei has collaborated with esteemed colleagues in the field, including Kwang-Ming Lin and Lih-Shyng Tsai. These collaborations have fostered a culture of innovation and have resulted in improved methodologies that benefit the semiconductor manufacturing process.

Conclusion

Chin-Twan Wei's contributions to the semiconductor industry through his patent demonstrate his expertise and innovative thinking. His method for creating void-free aluminum-copper metallurgy is a crucial advancement that enhances the quality of VLSI manufacturing. As technology continues to evolve, inventions like Wei's will play a significant role in shaping the future of semiconductor devices.

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