Chin-Ti Chen

Title: Innovations of Chin-Ti Chen in Semiconductor Technology

Introduction

Chin-Ti Chen is a prominent inventor based in Hsinchu, Taiwan, known for his significant contributions to semiconductor technology. With a total of four patents to his name, Chen has made remarkable advancements in the field, particularly in semiconductor packaging.

Latest Patents

One of his latest patents is titled "Semiconductor package having substrate ID code and its fabricating method." This invention reveals a semiconductor package that includes a substrate ID code, which is inscribed in the solder mask or encapsulant. This innovation allows for effective quality control and failure tracking without altering the package's appearance. The substrate ID code can be implemented using existing laser imprinting machines, ensuring that the complexity of the semiconductor packaging process remains manageable.

Another notable patent is the "Window BGA semiconductor package." This design features a substrate, a chip, and bonding wires that connect the chip to the substrate. The innovative structure includes a depression for the chip-bonding adhesive, which helps reduce the total package thickness and prevents delamination and fractures at the chip's sides. These advancements enhance the reliability and efficiency of semiconductor packages.

Career Highlights

Chin-Ti Chen is currently employed at Powertech Technology Inc., where he continues to push the boundaries of semiconductor technology. His work has been instrumental in developing new methods and designs that improve the performance and reliability of semiconductor packages.

Collaborations

Throughout his career, Chen has collaborated with notable colleagues, including Bing-Shun Yu and Chin-Fa Wang. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Chin-Ti Chen's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the field. His innovative designs and methods continue to shape the future of semiconductor packaging, ensuring enhanced quality and performance.