Company Filing History:
4 out of 14,084 
1 out of 1 Years Active: 2015-2021
Title: Chin Teong Ong: Innovator in Adhesive Technologies
Introduction
Chin Teong Ong is a prominent inventor based in Singapore, known for his contributions to adhesive technologies. With a total of 4 patents, he has made significant advancements in the field, particularly in the development of high-performance adhesive compositions.
Latest Patents
One of Ong's latest patents is for a high-temperature resistant masking adhesive composition. This innovative hot melt processable adhesive is designed to mask electronic components and includes a combination of block copolymers, tackifying resins, semi-crystalline polyolefin polymers, plasticizers, and anti-oxidants. The composition is thermally stable, capable of withstanding temperatures up to 260°C without degradation or flowing, while remaining optically transparent and cleanly removable after heating.
Another notable patent involves a display panel substrate assembly and the method for forming it. This invention features a substrate assembly comprising a first and a second substrate, with at least one being optically clear. The method includes screen printing a non-sag adhesive composition onto the first substrate and curing it in a controlled pressure environment, resulting in an optically clear adhesive layer.
Career Highlights
Chin Teong Ong has worked with several reputable companies, including 3M Innovative Properties Company and Trimech Technology Pte. Ltd. His experience in these organizations has contributed to his expertise in adhesive technologies and innovation.
Collaborations
Throughout his career, Ong has collaborated with notable colleagues such as Yi Lin Sim and Jonathan J O'Hare. These partnerships have likely fostered a creative environment that has led to the development of his patented technologies.
Conclusion
Chin Teong Ong's work in adhesive technologies showcases his innovative spirit and dedication to advancing the field. His patents reflect a commitment to creating high-performance solutions that meet the demands of modern applications.