The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2015

Filed:

Aug. 17, 2011
Applicants:

David J. Plaut, Minneapolis, MN (US);

Sean M. Tsuji, Tokyo, JP;

Chin Teong Ong, Singapore, SG;

Siang Kwang Lee, Singapore, SG;

Inventors:

David J. Plaut, Minneapolis, MN (US);

Sean M. Tsuji, Tokyo, JP;

Chin Teong Ong, Singapore, SG;

Siang Kwang Lee, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/02 (2006.01); B32B 37/14 (2006.01); B32B 37/12 (2006.01); C08L 23/22 (2006.01); C09J 7/04 (2006.01); C09J 163/00 (2006.01); C08L 63/00 (2006.01);
U.S. Cl.
CPC ...
B32B 37/14 (2013.01); Y10T 156/10 (2015.01); C08J 2363/00 (2013.01); C08K 2201/001 (2013.01); C08L 23/22 (2013.01); C08L 63/00 (2013.01); C09J 7/0203 (2013.01); C09J 7/043 (2013.01); C09J 163/00 (2013.01); B32B 37/1284 (2013.01);
Abstract

A low temperature curable epoxy tape is provided that can be useful as a semi-structural adhesive tape in the automotive, aerospace, and electronics industries to form metal-to-metal and metal-to-plastic bonds. The provided epoxy tape includes a curative layer. The curative layer includes a scrim, a binder layer at least partially enclosing the scrim, and a latent curative dispersed in the binder layer. The curative layer is coated and then dried of solvent. Then an epoxy layer is laminated to a top and a bottom of the curative layer. The epoxy tape is placed between two parts being bonded together and then heated to temperatures of bottom up to about 110° C. to activate and disperse the active curative. A semi-structural bond is formed. Also, a method of making the epoxy tape is provided.


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