The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 21, 2021

Filed:

Mar. 20, 2019
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Richard Yufeng Liu, Woodbury, MN (US);

Yi Lin Sim, Singapore, SG;

Chin Teong Ong, Singapore, SG;

Roger A. Grisle, Woodbury, MN (US);

Michael C. Martin, Hudson, WI (US);

Nathaniel I. Lehn, White Bear Lake, MN (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H05K 3/34 (2006.01); C08K 5/00 (2006.01); C08K 5/17 (2006.01); C08K 5/05 (2006.01); C08K 5/16 (2006.01); C09J 123/10 (2006.01); C09J 153/02 (2006.01);
U.S. Cl.
CPC ...
C09J 153/02 (2013.01); H05K 3/305 (2013.01); H05K 3/3494 (2013.01);
Abstract

Hot melt processable adhesive compositions to mask electronic components include at least one block copolymer, at least one tackifying resin, at least one semi-crystalline polyolefin polymer, at least one plasticizer, and at least one anti-oxidant. The adhesive composition is a hot melt processable pressure sensitive adhesive composition that is thermally stable, such that the composition when disposed on a surface withstands heating to 260° C. without degradation or flowing, remains optically transparent, and after heating to 260° C. remains cleanly removable.


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