Chin-Pei Tien

Title: Innovations of Chin-Pei Tien in Semiconductor Technology

Introduction

Chin-Pei Tien is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent related to laser methods for forming vias. His work is instrumental in advancing the efficiency and effectiveness of semiconductor manufacturing processes.

Latest Patents

Chin-Pei Tien holds a patent for a "Laser method for forming vias." This innovative method involves several steps, including providing a heat sink, locally oxidizing its surface into a copper oxide film, and bonding a substrate onto the heat sink. The substrate consists of a patterned trace layer and an insulating layer, which contains through holes exposing portions of the copper oxide film. The process further includes removing the copper oxide through laser beams, disposing of solder balls in the through holes, and reflowing the solder balls to create multiple vias. This patent showcases his expertise and creativity in semiconductor technology, with a total of 1 patent.

Career Highlights

Chin-Pei Tien is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate and contribute to the semiconductor industry. His work has not only enhanced the manufacturing processes but also improved the overall performance of semiconductor devices.

Collaborations

Throughout his career, Chin-Pei Tien has collaborated with talented individuals such as Chun-Chi Lee and Jaw-Shiun Hsieh. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Chin-Pei Tien's contributions to semiconductor technology through his innovative patent demonstrate his commitment to advancing the field. His work at Advanced Semiconductor Engineering, Inc. and collaborations with fellow inventors highlight the importance of teamwork in driving technological progress.