This inventor holds 2 USPTO granted patents. Top assignee: Harvatek Corporation. Active years: 2003.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2003
Title: Chin-Mau James Hwang: Innovator in Optoelectronic Packaging
Introduction
Chin-Mau James Hwang is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of optoelectronic packaging, holding 2 patents that showcase his innovative approach to semiconductor technology.
Latest Patents
One of his latest patents is titled "Focusing cup on a folded frame for surface mount optoelectric semiconductor package." This invention involves a focusing cup that is directly glued to two or more preformed folded metal frames. The design allows parts of the top surfaces of the folded metal frames to contact the electrodes of a semiconductor device placed inside the focusing cup. The bottoms of the metallic frames serve as the bottom contacts for surface mounting to a motherboard. This innovative approach eliminates the need for through holes, making the package narrower and allowing for a thinner design compared to prior art.
Another significant patent is "Adjustable in-line leads for light emitting device package." In this invention, the leads of a light emitting device package are extended as flexible pins. These pins can be bent with respect to a motherboard, allowing for the adjustment of the light emitted from the device. The package is tab-mounted to the motherboard for effective heat sinking or serving as a lead.
Career Highlights
Chin-Mau James Hwang is currently associated with Harvatek Corporation, where he continues to develop innovative solutions in the field of optoelectronics. His work has been instrumental in advancing the technology used in semiconductor packaging.
Collaborations
He has collaborated with notable colleagues such as Bill Chang and Bily Wang, contributing to a dynamic work environment that fosters innovation and creativity.
Conclusion
Chin-Mau James Hwang's contributions to optoelectronic packaging through his patents reflect his commitment to innovation in the semiconductor industry. His work continues to influence the development of more efficient and effective packaging solutions.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile