Harvatek Corporation

Chin-Mau James Hwang

Bill Chang

Bily Wang

Bily Wangn

A focusing cup is directly glued to two or more preformed folded metal frames. Parts of the top surfaces of the folded metal frames contact the electrodes of semiconductor device placed inside the focusing cup. The bottoms of the metallic frames serve as the bottom contacts for surface mounting to a motherboard. The preformed metallic frames need not withstand the stress of folding and the package can be made thinner than prior art. The elimination of the through holes makes the package narrower. The bottoms of the metallic frames can be aligned one side of the bottom surface of the package, so that the package can be surface-mounted normally to or in parallel with a motherboard with light emitting respectively in parallel with or normally to the surface of the motherboard.

Focusing cup on a folded frame for surface mount optoelectric semiconductor package

The leads of a light emitting device package are extended is flexible pins. These pins can be bent with respect to a motherboard so that the direction of the light entitled from the light emitting device can be adjusted. The package is tab-mounted to the motherboard for heat sinking or serving as a lead.

Growing community of inventors

Hsinchu, Taiwan

Chin-Mau James Hwang